Silicone Thermal Liquid Gap Filler

 LiPOLY’s DM series is two-part compound gap filler that can be cured at room temperature or high temperature. Compared with thermally conductive pad, the Two-Part Thermal conductive Gap filler not only produces low stress, high thermal conductivity, and low viscosity on the components, but also maintains insulation properties. Thermal conductivity: 2.2~7.0W/m*K. Ideally suited for LiPOLY Smart Dispense Robot which is the best choice for automated dispensing production.

 

  • PK223DM
    Datasheet
  • PK404DM
    Datasheet
  • PK605DM
    Datasheet
  • PK700DM
    Datasheet

    • Product Series Introduction

    Due to Internet of Things raise, electrical products has tendency to lighter, also with high power, high-speed, and high density. Because of the high power module pursued lighter, high density, high power, and the design of the chip and component pursued high capability, high baud, high efficiency, cause the waste heat and hotspot temperature rise quickly, which become the problem in desperate need to solve.